UMC communicates that the production of Through-Silicon-Via (TSV) is ramping up very well, at 300mm Fab 12i in Singapore.
TSV is produced on 40nm because a most recent process node (like 28nm HKMG) can't guarantee a better price/preformance ratio. Also, 40nm is a mature technology, so the yields are very good from the beginning (Last year UMC incresed the 40nm production lines).
Thanks to this increased production, AMD will be able to shave the price down (5-10$) of HBM+GPU package to improve the attractiveness of Radeon Fury cards.
Bryan Black, senior fellow at AMD said, “UMC's long track record of bringing innovative technologies from the R&D stage to volume production for customer products was a compelling reason for us to engage with them as our foundry for the interposer and associated TSV technology. They have again proven their ability to execute successfully with TSV on our latest high-performance GPU, and we are pleased to have them as a valuable supply-chain partner for our exciting new line of Radeon products”.