According to our source, TSMC is sampling the Interposer for the next GP100 NVIDIA GPUs … and it will be huge! We talking about a 1200 mm2 interposer (Fiji interposer is about 1000 mm2).

 

 

It's a great challenge for the two companies, especially for NVIDIA, because it's its first product of this kind. TSMC has some experience, thanks to Xilinx FPGAs, but this product is more delicate and large (current larger Xilinx interposer is 775 mm2). Also, GP100 will be packaged at TSMC (AMD Fiji is made by TSMC and packaged at Amkor).

AMD, UMC and Amkor is working together on this technology since 2000-2001, and their production line is already efficient (thanks to Fiji experience). Will TSMC and NVIDIA able to do a perfect high end product on the first try?